搜索结果: 1-13 共查到“知识库 电子技术 technology”相关记录13条 . 查询时间(0.152 秒)
An Electronically Reconfigurable Three Band Low-Noise Amplifier in 0.5 μm GaAs pHEMT Technology
RFIC MMIC LNA Reconfigurable IC
2014/12/8
State-of-the-art RF front-end circuits are typically designed to operate at a single frequency. With an increasing number of available wireless standards, personal mobile communication devices require...
Application of ACL Technology in the Security of IP DSLAM Network
Network security Access Control Technology Multi-layer Flow Classification
2010/7/16
In the processing of extending scale of network and enlarging flock of consumers,the security of network plays an extremely important role. This paper presents an access control technology to enhance ...
This paper presents the design of a 16/17 dualmodulus prescaler with maximum operating frequency of 30 GHz. The differential emitter-coupled logic (ECL) is employed to achieve high operating frequenci...
BME-Y5V Materials Prepared by Solid State Technology
Dielectric powders multilayer capacitors ceramic powders
2010/12/7
In this paper the properties of BME-Y5V dielectric powders prepared by solid state technology is described. A new formulation is presented, suitable in multilayer capacitors for layers down to 4μm . T...
Quasi-Monolithic Si-GaAs Hybrid Technology For Microwave And Millimeter-Wave Application
Quasi-Monolithic Si-GaAs Hybrid Technology Microwave Millimeter-Wave Application
2010/7/15
A novel planar quasi-monolithic (QM)hybrid integration technology for microwave and millimeter-wave application is presented. Microwave transistor chips are embedded in high-resistivity silicon substr...
High Frequency Circuits Based on GaAs-pHEMT Technology for Modern Sensor and Communication Systems
High Frequency Circuits GaAs-pHEMT Technology Modern Sensor Communication Systems
2010/7/15
For sensor and communication system applications, Monolithic Microwave Integrated Circuits (MMICs) feature performance, functionality, reliability, and competitive price. In this paper, the potential ...
Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
a New Back Panel Packaging Approach DIN and Reversed DIN board connectors
2010/12/23
Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained ...
Thick-Film Non-Reciprocal Ferrite Elements and Gunn Hybrid Oscillators in Modified Thick-Film Technology
Thick-Film Non-Reciprocal Ferrite Elements Gunn Hybrid Oscillators Modified Thick-Film Technology
2010/12/23
In this paper are presented design and performance data on microwave Y–circulators and Gunn oscillators produced in thick-film technology. Y–circulators have been designed for central frequencies of 3...
Permanent Interconnection Technology Electronic Interconnections – the Printed Wiring Board
interconnection and packaging systems printed circuit boards VLSI
2010/12/28
Modern manufacturing techniques which have been developed in respect of interconnection and packaging systems using printed circuit boards, are outlined. It is shown that these systems are capable of ...
Nichrome Thin Film Technology and its Application
Nichrome Thin Film Technology hybrid integrated circuits
2010/12/28
NiCr thin film resistors are widely used in the current resistor technology. Ranging from discrete resistors up to highest performance hybrid integrated circuits, vacuum deposited NiCr alloys cover ex...
IC Packaging Technology for Electronic Watches
IC Packaging Technology Electronic Watches
2010/12/29
IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays, the outside view of the quartz watch is the same as that of a mechanical watch through minimi...
Thin Film Technology Used in Bell System Telecommunication Circuits
Thin Film Technology Bell System Telecommunication Circuits
2011/1/5
This paper describes the thin film technology used for telecommunication circuits in the Bell System. Vacuum deposition and photolithography form the basis for the film processing steps. Nitrogen dope...
The different processing steps of S.A.W. technology are reviewed. Special attention is given to the technology of the distributed feedback resonator.